Display device, polarizing film and method for fabricating the polarizing film

ABSTRACT

A display device includes a display panel including a flat portion and a bending portion located at a side of the flat portion, an optical film attached on the flat portion of the display panel, and a bending protection layer covering at least a part of the bending portion and contacting one edge of the optical film. The edge of the optical film includes an upper surface, a lower surface and a side surface, the lower surface of the optical film faces an upper surface of the display panel, at least a part of the side surface of the optical film contacts the bending protection layer, and at least a part of the side surface of the optical film protrudes more, as closer to the upper side.

This application is a divisional of U.S. patent application Ser. No.17/022,593, filed on Sep. 16, 2020, which is a divisional of U.S. patentapplication Ser. No. 16/162,890, filed on Oct. 17, 2018, which claimspriority to Korean Patent Application No. 10-2018-0023645, filed on Feb.27, 2018, and all the benefits accruing therefrom under 35 U.S.C. § 119,the content of which in its entirety is herein incorporated byreference.

FIELD

Exemplary embodiments of the invention relate to a display device, apolarizing film, and a method for fabricating the polarizing film.

DISCUSSION OF RELATED ART

Display devices are becoming increasingly important with a developmentof multimedia. Various types of display devices such as organic lightemitting diode (“OLED”) display devices, liquid crystal display (“LCD”)devices, or the like are used in accordance with this trend.

Recent display devices maximize a display area for outputting visualinformation by bending one side of a substrate backwardly of the displayarea.

SUMMARY

In order to stably bend a panel as described above, a bending protectionlayer is disposed on the substrate to be bent. However, there is a riskthat the bending protection layer may become detached due to a restoringforce.

Exemplary embodiments of the invention may be directed to a displaydevice capable of reducing the risk of detachment of a bendingprotection layer.

In addition, exemplary embodiments of the invention may be directed to apolarizing film capable of reducing the risk of detachment of a bendingprotection layer when the polarizing film is applied to display devices.

The objective of the invention is not limited to the above-mentionedproblems, and other technical objectives may be clearly understood bythose skilled in the art from the following description.

According to an exemplary embodiment, a display device includes adisplay panel including a flat portion and a bending portion located ata side of the flat portion, an optical film attached on the flat portionof the display panel, and a bending protection layer covering at least apart of the bending portion and contacting an edge of the optical film.The edge of the optical film includes an upper surface, a lower surfaceand a side surface, the lower surface of the optical film faces an uppersurface of the display panel, at least a part of the side surface of theoptical film contacts the bending protection layer, and at least a partof the side surface of the optical film protrudes more, as closer to theupper surface.

In an exemplary embodiment, an internal angle between at least a part ofthe side surface of the optical film and the lower surface of theoptical film may be an obtuse angle.

In an exemplary embodiment, the internal angle may be greater than about110 degrees.

In an exemplary embodiment, the internal angle may be greater than about130 degrees.

In an exemplary embodiment, the internal angle may be less than about160 degrees.

In an exemplary embodiment, the side surface of the optical film may bea planar surface.

In an exemplary embodiment, the display device may further include anadhesive layer between the optical film and the display panel. A sidesurface of the adhesive layer may contact the side surface of theoptical film.

In an exemplary embodiment, the side surface of the adhesive layer mayhave a slope substantially equal to a slope of the side surface of theoptical film.

In an exemplary embodiment, the side surface of the optical film mayinclude a first surface that perpendicularly contacts the upper surfaceof the optical film.

In an exemplary embodiment, the side surface of the optical film mayfurther include a second surface contacting the first surface and thelower surface of the optical film.

In an exemplary embodiment, the side surface of the optical film mayfurther include a third surface contacting the first surface andparallel to the lower side of the optical film, and a fourth surfacecontacting the third surface and the lower surface of the optical film.

In an exemplary embodiment, the side surface of the optical film mayinclude a protruding portion or a recessed portion.

In an exemplary embodiment, the side surface of the optical film mayinclude a pattern of protruding portions or recessed portions that areregularly arranged.

In an exemplary embodiment, the side surface of the optical film mayinclude a pattern of protruding portions or recessed portions that areirregularly arranged.

In an exemplary embodiment, the display panel may include an organiclight emitting display panel, and the optical film may include apolarizing film.

In an exemplary embodiment, the display panel may include a passivationlayer, and the edge of the optical film may be aligned with one edge ofthe passivation layer.

In an exemplary embodiment, at least a part of the lower surface of theoptical film may contact the bending protection layer.

According to an exemplary embodiment, a display device includes adisplay panel including a flat portion and a bending portion located ata side of the flat portion; an optical film attached on the flat portionof the display panel; an adhesive layer between the display panel andthe optical film; and a bending protection layer covering at least apart of the bending portion and contacting an edge of the optical film.The edge of the optical film includes a lower surface that faces thedisplay panel, and at least a part of the lower surface of the opticalfilm contacts the bending protection layer.

In an exemplary embodiment, at least a part of the lower surface of theoptical film may not be covered by the adhesive layer.

In an exemplary embodiment, the bending protection layer may contact aside surface of the adhesive layer.

In an exemplary embodiment, a side surface of the adhesive layer may bea concavely curved surface which is recessed inwardly.

In an exemplary embodiment, the display panel may include a passivationlayer, and the edge of the optical film may be aligned with an edge ofthe passivation layer.

According to an exemplary embodiment, a polarizing film includes aplurality of edges. One of the plurality of edges includes a lowersurface, an upper surface, and a side surface, an adhesive layer isattached to the lower surface of the polarizing film, and at least apart of the side surface of the optical film protrudes more, as closerto the upper side.

In an exemplary embodiment, an internal angle between at least a part ofthe side surface of the optical film and the lower surface of theoptical film may be an obtuse angle.

In an exemplary embodiment, the side surface of the adhesive layer andthe side surface of the optical film may define a substantially samesurface.

In an exemplary embodiment, the side surface of the optical film mayinclude a first surface that perpendicularly contacts the upper surfaceof the optical film.

In an exemplary embodiment, the side surface of the optical film mayinclude a protruding portion or a recessed portion.

According to an exemplary embodiment, a polarizing film includes aplurality of edges; and an adhesive layer on a lower surface of thepolarizing film. At least a part of the lower surface of at least one ofthe plurality of edges is not covered by the adhesive layer.

According to an exemplary embodiment, a method for fabricating apolarizing film includes attaching an adhesive layer to a surface of thepolarizing film; attaching a protective film to the adhesive layer;pressing the polarizing film to which the adhesive layer is attached sothat the adhesive layer is stretched in a horizontal direction parallelto the surface of the polarizing film; cutting an edge of the polarizingfilm to which the adhesive layer is attached in a pressurized state; andstopping the pressing of the polarizing film to which the adhesive layeris attached so that the adhesive layer is reduced in the horizontaldirection.

In an exemplary embodiment, the method may further include overlapping aplurality of polarizing films, each attached with the adhesive layer andthe protective film. The cutting the edge of the polarizing film mayinclude cutting an edge of the plurality of overlapped polarizing films.

In an exemplary embodiment, the cutting the one edge of the polarizingfilm may include cutting the polarizing film so that a cut surface ofthe polarizing film is perpendicular to the surface of the polarizingfilm.

In an exemplary embodiment, the cutting the one edge of the polarizingfilm may include cutting the polarizing film so that an internal anglebetween a cut surface of the polarizing film and the surface of thepolarizing film is an obtuse angle.

The foregoing is illustrative only and is not intended to be in any waylimiting. In addition to the illustrative exemplary embodiments andfeatures described above, further exemplary embodiments and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention will become more apparentby describing in detail embodiments thereof with reference to theaccompanying drawings, in which:

FIG. 1 is a plan view illustrating an exemplary embodiment of an organiclight emitting diode (“OLED”) display device according to the invention;

FIG. 2 is a partial schematic cross-sectional view illustrating anexemplary embodiment of an OLED display device according to theinvention;

FIG. 3 is a cross-sectional view illustrating one pixel of an OLEDdisplay device;

FIG. 4 is a partial plan view illustrating an exemplary embodiment of anOLED display device according to the invention;

FIG. 5 is a schematic cross-sectional view illustrating the OLED displaydevice of FIG. 4;

FIG. 6 is an exploded perspective view illustrating an OLED displaydevice;

FIGS. 7 to 13 are schematic cross-sectional views illustrating anexemplary embodiment of an OLED display device according to theinvention;

FIG. 14 is a schematic cross-sectional view illustrating an exemplaryembodiment of an OLED display device according to the invention; and

FIGS. 15A to 15J are cross-sectional views illustrating an exemplaryembodiment of a method for fabricating a polarizing film according tothe invention.

DETAILED DESCRIPTION

Exemplary embodiments will now be described more fully hereinafter withreference to the accompanying drawings. Although the invention may bemodified in various manners and have several exemplary embodiments,exemplary embodiments are illustrated in the accompanying drawings andwill be mainly described in the specification. However, the scope of theinvention is not limited to the exemplary embodiments and should beconstrued as including all the changes, equivalents and substitutionsincluded in the spirit and scope of the invention.

In the drawings, thicknesses of a plurality of layers and areas areillustrated in an enlarged manner for clarity and ease of descriptionthereof. When a layer, area, or plate is referred to as being “on”another layer, area, or plate, it may be directly on the other layer,area, or plate, or intervening layers, areas, or plates may be presenttherebetween. Conversely, when a layer, area, or plate is referred to asbeing “directly on” another layer, area, or plate, intervening layers,areas, or plates may be absent therebetween. Further when a layer, area,or plate is referred to as being “below” another layer, area, or plate,it may be directly below the other layer, area, or plate, or interveninglayers, areas, or plates may be present therebetween. Conversely, when alayer, area, or plate is referred to as being “directly below” anotherlayer, area, or plate, intervening layers, areas, or plates may beabsent therebetween.

The spatially relative terms “below”, “beneath”, “less”, “above”,“upper” or the like, may be used herein for ease of description todescribe the relations between one element or component and anotherelement or component as illustrated in the drawings. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation, in addition tothe orientation depicted in the drawings. For example, in the case wherea device illustrated in the drawing is turned over, the devicepositioned “below” or “beneath” another device may be placed “above”another device.

Accordingly, the illustrative term “below” may include both the lowerand upper positions. The device may also be oriented in the otherdirection and accordingly the spatially relative terms may beinterpreted differently depending on the orientations.

Throughout the specification, when an element is referred to as being“connected” to another element, the element is “directly connected” tothe other element, or “electrically connected” to the other element withone or more intervening elements interposed therebetween. It will befurther understood that the terms “comprises,” “including,” “includes”and/or “including,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elementsand/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components and/or groups thereof.

It will be understood that, although the terms “first,” “second,”“third,” or the like may be used herein to describe various elements,these elements should not be limited by these terms. These terms areonly used to distinguish one element from another element. Accordingly,“a first element” discussed below could be termed “a second element” or“a third element,” and “a second element” and “a third element” may betermed likewise without departing from the teachings herein.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” may mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms used herein (including technical andscientific terms) have the same meaning as commonly understood by thoseskilled in the art to which this invention pertains. It will be furtherunderstood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an ideal or excessively formal sense unlessclearly defined in the specification.

Some of the parts which are not associated with the description may notbe provided in order to specifically describe exemplary embodiments ofthe invention and like reference numerals refer to like elementsthroughout the specification.

Hereinafter, exemplary embodiments of the invention will be describedwith reference to the accompanying drawings.

As used herein, display devices are display devices for displayingmoving images or still images. The display devices may be used as adisplay screen for various products such as televisions, notebooks,monitors, billboards, and internet of things, in addition to portableelectronic devices such as mobile phones, smart phones, tablet personalcomputers (“PCs”), smart watches, watch phones, mobile communicationterminals, electronic notebooks, electronic books, portable multimediaplayers (“PMPs”), navigation, and ultra mobile personal computers(“UMPCs)”. Examples of the display device may include organic lightemitting diode (“OLED”) display devices, LCD devices, plasma displaypanel (“PDP”) devices, field emission display (“FED”) devices,electrophoretic display (“EPD”) devices, or the like.

The display devices may include an optical film. The optical film may beattached on the display panel of the display device to modulate orimprove the optical characteristics. The optical film may include apolarizing film. For example, the polarizing film may be attached to thedisplay surface of the OLED display device to reduce reflection ofexternal light, or may be attached to a display panel of the LCD deviceto adjust transmittance. Examples of the optical film may include aretardation film, a prism film, a micro lens film, a lenticular film, arelease film, a protective film, or the like, and the optical film maybe attached to the display device to be used according to variouspurposes of use.

Hereinafter, a polarizing film will be described as an optical filmaccording to an exemplary embodiment of the invention, and an OLEDdisplay device will be described as a display device according to anexemplary embodiment of the invention, but the invention is not limitedthereto.

FIG. 1 is a plan view illustrating an OLED display device according toan exemplary embodiment of the invention, and FIG. 2 is a partialschematic cross-sectional view illustrating an OLED display deviceaccording to an exemplary embodiment of the invention. In the plan viewof FIG. 1, the upper, lower, left, and right directions are defined forconvenience of explanation. The up and down direction is the verticaldirection or the column direction, and the left and right direction isthe horizontal direction or the row direction. As used herein, the terms“upper edge”, “lower edge”, “left edge”, and “right edge” of thepolarizing film or the like refer to edges or ends located on the upperside, the lower side, the left side, and the right side of thepolarizing film in a plan view, respectively. It should be understoodthat the directions mentioned in the exemplary embodiments of theinvention are referred to as relative directions, and the invention isnot limited to the mentioned directions.

Referring to FIGS. 1 and 2, an OLED display device 70 includes a displayarea DA and a non-display area NDA around the display area DA.

The display area DA is an area for displaying images on a screen. Theplanar shape of the display area DA may be a quadrangular shape or aquadrangular shape with rounded corners. As used herein, an upper side,a lower side, a left side, and a right side of the quadrangular shapewill be referred to as an upper edge, a lower edge, a left edge, and aright edge, respectively. The planar shape of the display area DA is notlimited to a quadrangle, and the display area DA may have various shapessuch as a circular shape and an elliptical shape. The display area DAincludes an active region 71 a including a plurality of pixels. Thecross-sectional structure of the pixel will be described below withreference to FIG. 3.

The non-display area NDA is arranged around the display area DA. Thenon-display area NDA may constitute the edge of the OLED display device70.

A driver for driving pixel circuits of the display area DA may bedisposed in the non-display area NDA. The driver may include a drivingcircuit and a driving wiring for transmitting a driving signal.

The OLED display device 70 may include a polarizing (refer to ‘POL’ inFIGS. 2 and 3) film 200 disposed on a display surface. The polarizingfilm 200 may be attached on the display surface of the OLED displaydevice 70 through an adhesive layer 400. The polarizing film 200 mayinclude four edges (or ends) of a lower edge BEG, an upper edge UEG, aleft edge LEG, and a right edge REG. The lower edge BEG and the upperedge UEG of the polarizing film 200 may face each other, and the leftedge LEG and the right edge REG of the polarizing film 200 may face eachother.

The polarizing film 200 may cover the entire display area DA. Inaddition, the polarizing film 200 may extend outwardly from an outeredge of the display area DA to cover at least a part of the non-displayarea NDA. In an exemplary embodiment, the upper edge UEG, the left edgeLEG and the right edge REG of the polarizing film 200 may be alignedwith an upper edge, a left edge, and a right edge of the non-displayarea NDA, respectively, for example. The lower edge BEG of thepolarizing film 200 may be located more inwardly than a lower edge BEGof the non-display area NDA (i.e. between the lower edge of the displayarea DA and the lower edge of the non-display area NDA), so that a partof the non-display area NDA on the side of the lower edge BEG may beexposed. However, the invention is not limited thereto, and a part ofthe non-display area NDA may be exposed on the side of another edge. Aside surface of at least one edge of the polarizing film 200 may have anasymmetric shape in the thickness direction, and may have an inclinationso that the upper side protrudes more than the lower side in thethickness direction, a detailed description of which will be describedbelow.

In an exemplary embodiment of the invention, the OLED display device 70may include a flat portion and a bending portion. The flat portionincludes an upper flat portion 71 and a lower flat portion 73 whichoverlap each other in the thickness direction (e.g., vertical directionin FIG. 2), and further includes a bending portion 72 between the twoflat portions 71 and 73. The bending portion 72 may be bent in thedirection opposite to the display direction (e.g., the lower directionin FIG. 2 in a case of a top emission type) with respect to the upperflat portion 71. The bending portion 72 may be disposed on at least oneside of the upper flat portion 71. Although it is illustrated in thedrawings that one bending portion 72 is disposed close to a lower edgeof the upper flat portion 71, the bending portion 72 may be disposed onthe side of two or more edges of the upper flat portion 71. In anexemplary embodiment, the bending portion 72 may be disposed on the sideof the lower edge and an upper edge of the upper flat portion 71, forexample. In addition, the bending portion 72 may be disposed adjacent toother edges, e.g., a left edge, a right edge, or an upper edge, otherthan the lower edge of the upper flat portion 71.

The display area DA and a part of the non-display area NDA may bedisposed at the upper flat portion 71. Another part of the non-displayarea NDA may be disposed at the bending portion 72 and the lower flatportion 73. Accordingly, when at least a part of the non-display areaNDA is bent in a direction opposite to the display direction, the bezelof the OLED display device 70 may be reduced.

First, the non-display area NDA located at the upper flat portion 71will be described. A scan driver 60 may be disposed at the non-displayarea NDA adjacent to the left edge and/or the right edge of the displayarea DA. The scan driver 60 may include a scan driver circuit and a scansignal wiring for transmitting a scan signal output from the scan drivercircuit.

A driving signal wiring for transmitting a driving signal from a drivingchip 51 may be disposed in the non-display area NDA adjacent to thelower edge of the display area DA. The driving chip 51 may be directlydisposed (e.g., mounted) in the non-display area NDA of the lower flatportion 73 or the bending portion 72 so as to be connected to thedriving signal wiring. In an alternative exemplary embodiment, a printedcircuit board 50 on which the driving chip 51 is disposed (e.g.,mounted) may be attached to the lower flat portion 73 or the bendingportion 72 such that the driving chip 51 and the driving signal wiringin the non-display area NDA may be electrically connected to each other.

A part of the non-display area NDA of the upper flat portion 71 adjacentto the lower edge of the display area DA may include a fan-out region 71b, an electrostatic dispersion region 71 c (refer to ‘ESD Region’ inFIG. 2), and a wiring contact region 71 d (refer to ‘CNT Region’ in FIG.2) which are disposed sequentially in an outward direction (e.g., rightdirection in FIG. 2). The bending portion 72 may be disposed adjacent toan outer side of the wiring contact region 71 d.

A wiring for transmitting signals to each of a data line, a powervoltage line, and a scan driver in the display area DA may be disposedat the fan-out region 71 b.

The electrostatic dispersion region 71 c includes an electrostaticdispersion circuit. The electrostatic dispersion circuit serves toeliminate the static electricity that may be generated in themanufacturing process or driving, thereby preventing damage to the pixelcircuits in the active region 71 a in the display area DA or the scandriving circuit of the scan driver 60. The electrostatic dispersioncircuit may include at least one electrostatic diode. In an exemplaryembodiment, the electrostatic diode may include one or more thin filmtransistors.

The wiring contact region 71 d includes a contact (refer to ‘CNT1’ inFIG. 5) for electrically connecting wirings of different layers. Asignal wiring (e.g., including a first or second gate conductive layer)(refer to ‘SWR’ in FIG. 5) extending from the display area DA throughthe fan-out region 71 b and the electrostatic dispersion region 71 c maybe electrically connected to a bending wiring (e.g., including a firstand second source/drain conductive layer) (refer to ‘BWR’ in FIG. 5)that is located on a different layer through a contact (refer to ‘CNT1’in FIG. 5) of the wiring contact region 71 d.

The bending wiring may extend from the bending portion 72 to the lowerflat portion 73. The bending wiring may be electrically connected to adriving wiring (e.g., including a first or second gate conductive layer)that is located on a different layer through a contact (not shown)located at the lower flat portion 73. The driving chip 51 or the printedcircuit board 50 on which the driving chip 51 is disposed (e.g.,mounted) may be electrically connected to a pad of the driving wiringthrough an anisotropic conductive film or the like.

A bending protection layer 300 (refer to ‘SNL’ in FIGS. 2 and 5) may bedisposed at the bending portion 72. The bending protection layer 300(refer to FIG. 5) may serve to protect a substrate (refer to ‘20’ inFIG. 3) and the bending wiring, and to reduce bending stress by coveringthe bending portion 72. The bending protection layer 300 may partiallyextend to the upper flat portion 71 and the lower flat portion 73, andmay contact the lower edge BEG of the polarizing film 200. The bendingprotection layer 300 may be partially removed from an area disposed(e.g., mounted) with the driving chip 51 and the printed circuit board50 of the lower flat portion 73 to expose the driving wiring pad.

In an exemplary embodiment, a horizontal width (e.g., along a horizontaldirection in FIG. 1) of the bending portion 72 and the lower flatportion 73 may be less than a horizontal width of the upper flat portion71 across the display area DA. In addition, similar to the bendingportion 72, a horizontal width of the wiring contact region 71 d, theelectrostatic dispersion region 71 c, the fan-out region 71 b of theupper flat portion 71 adjacent to the bending portion 72 may be lessthan the horizontal width of the upper flat portion 71 across thedisplay area DA.

The polarizing film 200 may cover the display area DA of the upper flatportion 71, cover the fan-out region 71 b of the non-display area NDA,and cover at least a part of the electrostatic dispersion region 71 c.The polarizing film 200 may expose the bending portion 72, and expose atleast a part of the wiring contact region 71 d of the upper flat portion71. The lower edge BEG of the polarizing film 200 may be positionedbetween the electrostatic dispersion region 71 c and the wiring contactregion 71 d. It is illustrated in the drawings that the lower edge BEGof the polarizing film 200 is located at a boundary between theelectrostatic dispersion region 71 c and the wiring contact region 71 d,but the lower edge BEG of the polarizing film 200 may be disposed on theelectrostatic dispersion region 71 c or on the wiring contact region 71d.

A side surface of the lower edge BEG of the polarizing film 200 maycontact a side surface of the bending protection layer 300. In anexemplary embodiment, an upper side of at least a part of the sidesurface of the lower edge BEG of the polarizing film 200 protrudes more,as compared to a lower side thereof, and thus the side surface of thelower edge BEG of the polarizing film 200 faces downwardly, which is thedirection from an upper surface to a lower surface. In addition, theside surface of the bending protection layer 300 may have an inclinedsurface corresponding thereto. An inclination angle of the side surfaceof the polarizing film 200 and an inclination angle of the side surfaceof the bending protection layer 300 which contact each other may beabout 180 degrees, for example.

Pattern films 80 a and 80 b are attached beneath the upper flat portion71 and the lower flat portion 73 by an adhesive layer (not shown). Thepattern film 80 a on the upper side may extend at the upper flat portion71 to the boundary with the bending portion 72. The pattern film 80 b onthe lower side may extend at the lower flat portion 73 to the boundarywith the bending portion 72. Edges of the pattern films 80 a and 80 btoward the bending portion 72 may be spaced apart from the boundary withthe bending portion 72. The pattern films 80 a and 80 b serve to supportthe flat portions 71 and 73 of a display panel 100 and allow the bendingportion 72 to maintain a gentle curve having a constant curvature.

Hereinafter, the cross-sectional structure of the OLED display devicewill be described in more detail.

FIG. 3 is a cross-sectional view illustrating one pixel of an OLEDdisplay device.

Referring to FIG. 3, the pixel of the OLED display device 70 includes atleast one thin film transistor TFT, a storage capacitor Cst, and an OLEDdisposed on a substrate 20. The thin film transistor TFT includes asemiconductor layer PS, a gate electrode GE, a source electrode SE, anda drain electrode DE. The storage capacitor Cst includes a firstelectrode CSE1 and a second electrode CSE2. The OLED includes an anodeelectrode ANO, a cathode electrode CAT, and an organic layer EL disposedtherebetween.

The substrate 20 supports each layer disposed thereon. The substrate 20may include an insulating material. In an exemplary embodiment, thesubstrate 20 may include an inorganic material such as glass or quartz,or may include an organic material such as polyimide. The substrate 20may be a rigid substrate or a flexible substrate.

A buffer layer 21 is disposed on the substrate 20. The buffer layer 21may substantially prevent diffusion of impurity ions, substantiallyprevent penetration of moisture or outside air, and perform a surfaceplanarization function. In an exemplary embodiment, the buffer layer 21may include an insulating material, and may include silicon nitride,silicon oxide, silicon oxynitride, or the like, for example.

The semiconductor layer PS is disposed on the buffer layer 21. Thesemiconductor layer PS forms a channel of the thin film transistor TFT.The semiconductor layer PS may include polycrystalline silicon. Impurityions (e.g., p-type impurity ions in a case of a PMOS transistor) may bedoped at a portion (source/drain region) of the semiconductor layer PSconnected to the source/drain electrodes SE and DE of the thin filmtransistor TFT. In an exemplary embodiment, a trivalent dopant such asboron (B) may be used as a p-type impurity ion, for example. In anotherexemplary embodiment, the semiconductor layer PS may includemonocrystalline silicon, low temperature polycrystalline silicon,amorphous silicon, or an oxide semiconductor such as indium tin zincoxide (“ITZO”) or indium gallium zinc oxide (“IGZO”).

A gate insulating layer 22 is disposed on the semiconductor layer PS.

A first gate conductive layer is disposed on the gate insulating layer22. The first gate conductive layer includes the gate electrode GE ofthe thin film transistor TFT and the first electrode CSE1 of the storagecapacitor Cst. In addition, the first gate conductive layer may includea scan signal wiring for transmitting a scan signal to the gateelectrode GE.

A first insulating interlayer 23 is disposed on the first gateconductive layer.

Each of the gate insulating layer 22 and the first insulating interlayer23 may include an inorganic material such as silicon oxide, siliconnitride, silicon oxynitride, or the like.

A second gate conductive layer is disposed on the first insulatinginterlayer 23. The second gate conductive layer may include the secondelectrode CSE2 of the storage capacitor Cst. The first electrode CSE1and the second electrode CSE2 may form the storage capacitor Cstincluding the first insulating interlayer 23 as a dielectric layer.

In an exemplary embodiment, each of the first gate conductive layer andthe second gate conductive layer may include one or more metal ofmolybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta),tungsten (W), and copper (Cu), for example. Each of the first gateconductive layer and the second gate conductive layer may have asingle-layered structure or a multilayered structure.

A second insulating interlayer 24 is disposed on the second gateconductive layer. However, the second insulating interlayer 24 mayinclude an inorganic layer or an organic layer including an organicmaterial.

A first source/drain conductive layer is disposed on the secondinsulating interlayer 24. The first source/drain conductive layer mayinclude the source electrode SE and the drain electrode DE of the thinfilm transistor TFT and a power voltage electrode ELVDDE. The sourceelectrode SE and the drain electrode DE of the thin film transistor TFTmay be electrically connected to the source region and the drain regionof the semiconductor layer PS through a contact hole defined through thesecond insulating interlayer 24, the first insulating interlayer 23, andthe gate insulating layer 22.

A first via layer 25 is disposed on the first source/drain conductivelayer.

A second source/drain conductive layer is disposed on the first vialayer 25. The second source/drain conductive layer may include a datasignal line DL, a connection electrode CE, and a power voltage lineELVDDL.

The data signal line DL may be electrically connected to the sourceelectrode SE of the thin film transistor TFT through a contact holedefined through the first via layer 25. The connection electrode CE maybe electrically connected to the drain electrode DE of the thin filmtransistor TFT through a contact hole defined through the first vialayer 25. The power voltage line ELVDDL may be electrically connected tothe power voltage electrode ELVDDE through a contact hole definedthrough the first via layer 25.

Each of the first source/drain conductive layer and the secondsource/drain conductive layer may include one or more metal ofmolybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta),tungsten (W), and copper (Cu).

Each of the first source/drain conductive layer and the secondsource/drain conductive layer may have a single-layered structure or amultilayered structure.

A second via layer 26 is disposed on the second source/drain conductivelayer. The first via layer 25 and the second via layer 26 describedabove may be an organic layer including an organic insulating material.

The anode electrode ANO is disposed on the second via layer 26. Theanode electrode ANO is connected to the connection electrode CE througha contact hole defined through the second via layer 26, and may beelectrically connected to the drain electrode DE of the thin filmtransistor TFT through the contact hole.

A pixel defining layer 27 may be disposed on the anode electrode ANO. Anopening that exposes the anode electrode ANO may be defined in the pixeldefining layer 27. The pixel defining layer 27 may include an organicinsulating material or an inorganic insulating material.

An organic layer EL is disposed in the opening of the pixel defininglayer 27. The organic layer EL may include an organic light emittinglayer EL1, a hole injection/transport layer EL2, and an electroninjection/transport layer EL3. It is exemplified in the drawings thateach of the hole injection/transport layer EL2 and the electroninjection/transport layer EL3 is provided as one layer, but a pluralityof layers of the injection layer and the transport layer may be stacked.In addition, at least one of the hole injection/transport layer EL2 andthe electron injection/transport layer EL3 may be a common layerdisposed over a plurality of pixels.

The cathode electrode CAT is disposed on the organic layer EL and thepixel defining layer 27. The cathode electrode CAT may be a commonelectrode disposed over a plurality of pixels.

A passivation layer 28 may be disposed on the cathode electrode CAT. Thepassivation layer 28 includes an inorganic material. The passivationlayer 28 may include a plurality of stacked layers. In an exemplaryembodiment, the passivation layer 28 may include a first inorganic layer28 a, an organic layer 28 b, and a second inorganic layer 28 c which aresequentially stacked, for example.

An adhesive layer 400 may be disposed on the passivation layer 28, and apolarizing film 200 may be disposed on the adhesive layer 400.

FIG. 4 is a partial plan view illustrating an OLED display deviceaccording to an exemplary embodiment of the invention. FIG. 5exemplifies a partial plan view of a non-display area adjacent to thelower edge of the display area of FIG. 1. FIG. 5 is a schematiccross-sectional view illustrating the OLED display device of FIG. 4. Inthe cross-sectional view of FIG. 5, the insulating layer and theconductive layer are simplified for convenience of explanation.

Referring to FIGS. 4 and 5, a first insulating layer 31, a firstconductive layer 41, a second insulating layer 32, a second conductivelayer 42, and a third insulating layer 33 are sequentially disposed onthe substrate 20. The first conductive layer 41 and the secondconductive layer 42 are electrically connected to each other in thewiring contact region 71 d through the contact CNT1.

The first conductive layer 41 and the second conductive layer 42 areconductive layers disposed on layers different from each other, and thesecond conductive layer 42 may be disposed above the first conductivelayer 41. In an exemplary embodiment, the first conductive layer 41 mayinclude the first gate conductive layer or the second gate conductivelayer of FIG. 3, and the second conductive layer 42 may include thefirst source/drain conductive layer or the second source/drainconductive layer of FIG. 3, for example. In the case where, for example,the first conductive layer 41 includes the first gate conductive layerand the second conductive layer 42 includes the first source/drainconductive layer, the first insulating layer 31 may include the bufferlayer 21, the gate insulating layer 22, the first insulating interlayer23 of FIG. 3, the second insulating layer 32 may include the secondinsulating interlayer 24 of FIG. 3, and the third insulating layer 33may include the first via layer 25, the second via layer 26, and thepixel defining layer 27 of FIG. 3.

The first insulating layer 31 is disposed on the substrate 20, and maybe disposed over the fan-out region 71 b, the electrostatic dispersionregion 71 c, and the wiring contact region 71 d.

The first conductive layer 41 includes the signal wiring SWR. The signalwiring SWR may extend from the fan-out region 71 b to the wiring contactregion 71 d via the electrostatic dispersion region 71 c.

The second insulating layer 32 may cover the first conductive layer 41.

The second conductive layer 42 is disposed on the first insulating layer31. The second conductive layer 42 includes the bending wiring BWR. Thebending wiring BWR partially overlaps the first conductive layer 41 inthe wiring contact region 71 d and is electrically connected to thefirst conductive layer 41 through a contact hole CTH defined through thesecond insulating layer 32. The second conductive layer 42 may also bedisposed in the electrostatic dispersion region 71 c (refer to ‘EDM’) toform the electrostatic dispersion circuit together with the firstconductive layer 41.

The third insulating layer 33 covers the second conductive layer 42. Itis exemplified in the drawings that the third insulating layer 33 isdisposed in the electrostatic dispersed region 71 c and the wiringcontact region 71 d, and is not disposed in the fan-out region 71 b.However, the invention is not limited thereto, and the third insulatinglayer 33 may also be disposed in the fan-out region 71 b.

The passivation layer 28 is disposed on the third insulating layer 33.The passivation layer 28 may include the first inorganic layer 28 a, theorganic layer 28 b, and the second inorganic layer 28 c. A side surfaceof the organic layer 28 b may be covered with the second inorganic layer28 c.

The passivation layer 28 covers the display area DA, and extends to thenon-display area NDA adjacent to the lower edge of the display area DAto cover the fan-out region 71 b and the electrostatic dispersion region71 c. On a plane, a lower edge of the passivation layer 28 may bepositioned between the electrostatic dispersion region 71 c and the wirecontact region 71 d. Although it is exemplified in the drawings that aside surface of the lower edge of the passivation layer 28 is located atthe boundary between the electrostatic dispersing region 71 c and thewiring contact region 71 d, the side surface of the lower edge of thepassivation layer 28 may be located on the electrostatic dispersionregion 71 c, or on the wiring contact region 71 d.

The adhesive layer 400 and the polarizing film 200 are disposed on thepassivation layer 28. Lower edges of the polarizing film 200 and theadhesive layer 400 may be aligned with the lower edge of the passivationlayer 28 in a plan view.

At least a part of a side surface 230 of the lower edge BEG of thepolarizing film 200 faces downwardly in the thickness direction, thatis, the direction from an upper surface 210 of the polarizing film 200to a lower surface 220 of the polarizing film 200. Referring to FIG. 5,at least a part of the side surface 230 of the lower edge BEG of thepolarizing film 200 has an inclined surface that protrudes more, ascloser to the upper side.

In an exemplary embodiment, an inclination angle θ of a portion of theside surface 230 of the lower edge BEG of the polarizing film 200 (or aninternal angle between the side surface 230 and the lower surface 220)may be an obtuse angle, i.e., greater than about 90 degrees and lessthan about 180 degrees, for example. When the polarizing film 200including the side surface having an obtuse inclination angle is alignedwith the passivation layer 28 therebeneath, a reference plane is thelower surface 220 of the polarizing film 200. In such an exemplaryembodiment, the upper surface 210 of the polarizing film 200 may belocated more outwardly than the side surface of the passivation layer28.

In addition, an inclination angle of a portion of the side surface 230may be about 180 degrees, that is, the portion of the side surface 230may be parallel to the lower surface, for example. Accordingly, at thisposition, the upper surface 210 of the polarizing film 200 may protrudemore outwardly than the lower surface 220 of the polarizing film 200.The detailed shape of the polarizing film 200 will be described belowwith reference to FIGS. 7 to 13.

The adhesive layer 400 may contact the lower surface 220 of thepolarizing film 200. In an exemplary embodiment, the adhesive layer 400may include a pressure sensitive adhesive (“PSA”). A planar shape of theadhesive layer 400 may be substantially the same as a planar shape ofthe lower surface 220 of the polarizing film 200. In an alternativeexemplary embodiment, the planar shape of the adhesive layer 400 may beless than the planar shape of the lower surface 220 of the polarizingfilm 200 so that a part of the lower surface 220 may be exposed at thelower edge BEG, which will be described below with reference to FIGS.14. An inclination angle of a side surface of a lower edge of theadhesive layer 400 located under the polarizing film 200 may beperpendicular. In addition, side surfaces of the remaining edges of theadhesive layer 400 may have a perpendicular inclination angleirrespective of whether the edge of the polarizing film 200 thereabovehas an asymmetric shape. In an alternative exemplary embodiment, theside surface of the lower edge of the adhesive layer 400 may have aninclination angle substantially equal to that of the side surface 230 ofthe polarizing film 200. The inclination angle of the edge of theadhesive layer 400 is not limited by the above examples, and may havevarious shapes or inclination angles.

The side surface 230 of the lower edge BEG of the polarizing film 200may be disposed on a plane and its cross-section may be linear. In analternative exemplary embodiment, the side surface 230 of the lower edgeBEG of the polarizing film 200 may include a plurality of planes havingdifferent slopes from each other.

The bending protection layer 300 may be disposed on the third insulatinglayer 33 at the wiring contact region 71 d which is not covered with thepassivation layer 28. The side surface of the bending protection layer300 may contact the side surface of the passivation layer 28, the sidesurface of the adhesive layer 400, and the side surface 230 of thepolarizing film 200. The bending protection layer 300 may include anorganic material and may cover a side profile that includes thepassivation layer 28, the adhesive layer 400, and the polarizing film200. Accordingly, the inclination angle of the side surface of thebending protection layer 300 corresponds to the inclination angle of theside surface of the passivation layer 28, the side surface of theadhesive layer 400, and the side surface of the polarizing film 200. Thesum of the side inclination angle of two members whose side inclinationangles correspond to each other may be about 180 degrees, for example.In an exemplary embodiment, the inclination angle of the side surface ofthe bending protection layer 300 at a portion where the bendingprotection layer 300 contacts the passivation layer 28 and the adhesivelayer 400 may be about 90 degrees, while the inclination angle of theside surface of the bending protection layer 300 at a portion where thebending protection layer 300 contacts the polarizing film 200 may be ina range from about 0 degree to about 89 degrees, for example.

The bending protection layer 300 may be located on the side surface 230of the polarizing film 200, but the bending protection layer 300 or theconstituent material thereof may not be located on the upper surface 210of the polarizing film 200. It is exemplified in the drawings that aheight of an upper surface of the bending protection layer 300 issubstantially equal to a height of the upper surface 210 of thepolarizing film 200 so that the bending protection layer 300 completelycovers the side surface 230 of the polarizing film 200, but the heightof the upper surface of the bending protection layer 300 may be lessthan the height of the upper surface 210 of the polarizing film 200 andthus the bending protection layer 300 may expose a part of an upper endof the side surface 230 of the polarizing film 200. In addition, theheight of the upper surface of the bending protection layer 300 may begreater than the height of the upper surface 210 of the polarizing film200.

As further described in the following descriptions of the OLED displaydevice, when one side surface 230 of the polarizing film 200 thatcontacts the bending protection layer 300 faces downwardly, the upwardrestoring force of the bending protection layer 300 is canceled, andthus the risk of detachment of the bending protection layer 300 may bereduced. In addition, the contact area between the polarizing film 200and the bending protection layer 300 may be increased to increase theadhesive force of the bending protection layer 300.

FIG. 6 is an exploded perspective view illustrating an OLED displaydevice.

Referring to FIG. 6, the OLED display panel 100 includes the passivationlayer 28. The passivation layer 28 may cover the upper edge, the leftedge, and the right edge of the upper flat portion 71 (refer to FIG. 1)of the OLED display panel 100, and expose a part of the lower side ofthe upper flat portion 71 of the OLED display panel 100.

The adhesive layer 400 is attached to the lower surface 220 of thepolarizing film, and a release film 440 is disposed on the upper surface210 of the polarizing film. The release film 440 serves to protect theupper surface 210 of the polarizing film 200, and may be omitted in somecases.

In addition, the polarizing film 200 is disposed on the passivationlayer 28 so that the adhesive layer 400 on the lower surface 220 of thepolarizing film 200 contacts the upper surface of the passivation layer28. The polarizing film 200 may have a planar shape substantially thesame as the planar shape of the passivation layer 28. The polarizingfilm 200 may already have the final shape before being attached. In analternative exemplary embodiment, the final shape of the polarizing film200 may be processed through a cutting process using laser or the likeafter being attached.

Hereinafter, the shape of the polarizing film of the OLED display devicewill be described in detail with reference to FIGS. 7 to 13.

FIG. 7 shows a polarizing film 200 in which the side surface 230 (referto FIG. 5) comprised of a first surface 231, which is one plane, and theinclination angle of the side surface 230 (or the internal angle betweenthe lower surface 220 and the side surface 230) is an obtuse angle.Accordingly, the side surface 230 protrudes further, as closer to theupper side, in the entire area of the side surface 230. In addition, theentire side surface 230 faces downwardly (the direction from the uppersurface 210 to the lower surface 220, the same hereinafter).

The concept of that one surface faces downwardly does not only mean thatthe surface is perpendicular to a back surface thereof, but also meansthat an outward direction perpendicular to the surface crosses the backsurface (or an imaginary planar surface extending from the backsurface). The concept of that one surface faces upwardly means that anoutward direction perpendicular to the surface crosses an upper surface(or an imaginary planar surface extending from the upper surface).

The bending protection layer 300 contacting the side surface 230 thatfaces downwardly is disposed beneath the side surface 230 in thethickness direction. Accordingly, the upward restoring force of thebending protection layer 300 may be canceled. In addition, the contactsurface is larger when the side surface 230 at which the polarizing film200 contacts the bending protection layer 300 is inclined, as comparedto the case where the side surface 230 is perpendicular thereto.

The inclination angle of the side surface 230 of the polarizing film 200is an obtuse angle, that is, greater than about 90 degrees and less thanabout 180 degrees. As the inclination angle increases, the adhesiveforce with the bending protection layer 300 increases, but the risk ofbreakage of the polarizing film 200 also increases. Accordingly, theinclination angle of the side surface 230 of the polarizing film 200 maybe in a range from about 110 degrees to about 160 degrees, and moredesirably, in a range from about 130 degrees to about 140 degrees, forexample.

The side surface 410 of the adhesive layer 400 may be located on a planesubstantially the same as a plane on which the side surface 230 of thepolarizing film 200 is disposed. However, the invention is not limitedthereto, and the side surface of the adhesive layer 400 may beperpendicular to the lower surface 220, which is also applied to thefollowing embodiments, and a description thereof will be omitted.

FIG. 8 shows a polarizing film 200 of which the side surface 230 (referto FIG. 5) includes two planes that cross each other. The side surface230 of the polarizing film 200 includes a first surface 231 whichcontacts the lower surface 220 of the polarizing film 200 and isinclined downwardly, and a second surface 232 which contacts the uppersurface 210 of the polarizing film 200 and is perpendicular to the uppersurface 210. The first surface 231 and the second surface 232 contacteach other between the upper surface 210 and the lower surface 220. Aninclination angle of the first surface 231 is substantially equal to aninclination angle of the side surface 230 of the polarizing film 200described with reference to FIG. 7.

A length of the second surface 232 in the thickness direction (e.g.,vertical direction in FIG. 8) may be substantially equal to or less thana length of the first surface 231 in the thickness direction.

Since an upper end of the side surface 230 of the polarizing film 200described with reference to FIG. 7 is sharp, there is a greater risk ofbreakage even when the inclination angle of the side surface 230 isreduced. Accordingly, the polarizing film 200 illustrated in FIG. 8includes a surface that is perpendicular to the upper surface 210 at theupper end of the side surface 230, thereby reducing the risk ofbreakage.

FIG. 9 shows a polarizing film 200 of which the side surface 230 (referto FIG. 5) includes three planes. The side surface 230 of the polarizingfilm 200 has a step-like shape that includes a first surface 234 whichcontacts the lower surface 220 and is perpendicular to the lowersurface, a second surface 232 which contacts the upper surface and isperpendicular to the upper surface, and a third surface 233 whichcontacts the first surface 234 and the second surface 232 and isparallel to the lower surface 220. The third surface 233 parallel to thelower surface 220 faces downwardly. Although it is illustrated in FIG. 9that the third surface 233 is parallel to the lower surface 220, theinvention is not limited thereto. In an exemplary embodiment, the thirdsurface 233 may have an arbitrary inclination angle greater than about90 degrees and less than about 180 degrees, for example. In addition,the third surface may have an inclination angle greater than about 180degrees and less than about 270 degrees, for example.

Although FIG. 9 illustrates one plane 233 parallel to the lower surface220, a plurality of planes parallel to the lower surface 220 and spacedapart from each other in the thickness direction may be provided. Thatis, the side surface 230 of the polarizing film 200 may have a patternof a plurality of steps.

In the case of the polarizing film 200 illustrated in FIG. 9, a contactarea between the side surface 230 and the bending protection layer 300may be larger than that of the obtuse inclination surface 230illustrated in FIG. 7, and a force of pressing the bending protectionlayer 300 may be larger than that of FIG. 7.

FIGS. 10 and 11 show a polarizing film having a protruding portion 241which protrudes outwardly of the polarizing film 200 and a recessedportion 242 recessed inwardly of the polarizing film 200.

The side surface 230 (refer to FIG. 5) of the polarizing film 200includes a first surface 231 which protrudes more, as closer to theupper side, and faces downwardly, and a second surface 235 whichprotrudes more, as closer to the lower side, and faces upwardly. Thesecond surface 235 is disposed at an upper portion of the protrudingportion 241, while the second surface 235 is disposed at a lower portionof the recessed portion 242. The first surface 231 and the secondsurface 235 may be symmetric in the thickness direction of thepolarizing film 200.

FIG. 12 shows a polarizing film having a pattern of a protruding portion241 (refer to FIG. 10) or a recessed portion 242 (refer to FIG. 11). Apattern where the protruding portion 241 or the recessed portion 242 areregularly repeated in the thickness direction may be disposed on theside surface 230 (refer to FIG. 5) of the polarizing film 200. Each ofthe protruding portion 241 or the recessed portion 242 may extendparallel to the lower surface 220. In an alternative exemplaryembodiment, the protruding portion 241 or the recessed portion 242 maybe inclined at an oblique angle with respect to the lower surface 220,for example, at about 45 degrees.

FIG. 13 shows a polarizing film 200 having a pattern in which aprotruding portion 241 (refer to FIG. 10) or a recessed portion 242(refer to FIG. 11) are irregularly repeated in the thickness direction.The irregular pattern may be provided by rough polishing or the like.

FIG. 14 is a schematic cross-sectional view illustrating an OLED displaydevice according to an exemplary embodiment of the invention.

Since the description of FIG. 14 is substantially the same as that ofFIG. 5, excluding the structure and disposition of the polarizing film200 and the adhesive layer 400, redundant description will be omitted.

As illustrated in FIG. 14, a part of the lower surface 220 of thepolarizing film 200 contacts the bending protection layer 300 at theedge BEG (refer to FIG. 1) of the polarizing film 200 that contacts thebending protection layer 300. Accordingly, the side surface 410 of theadhesive layer 400 and the side surface 230 of the polarizing film 200are misaligned such that the side surface 410 of the adhesive layer 400and the side surface 230 of the polarizing film 200 do not contact eachother. The shape of the upper surface of the adhesive layer 400 is lessthan the shape of the lower surface 220 of the polarizing film 200, atthe edge in contact with the bending protection layer 300. Accordingly,the lower surface 220 of the polarizing film 200 is not covered by theadhesive layer 400 at the edge in contact with the bending protectionlayer 300.

The bending protection layer 300 is disposed between the lower surface220 of the polarizing film 200 and the display panel 100. The bendingprotection layer 300 contacts the side surface 230 and the lower surface220 of the polarizing film 200. The bending protection layer 300 maycontact the side surface 410 of the adhesive layer 400.

In an exemplary embodiment, the lower edge BEG of the polarizing film200 may be aligned with the lower edge of the passivation layer 28.Accordingly, the adhesive layer 400 and the lower edge of thepassivation layer 28 are misaligned such that the upper surface of thepassivation layer 28 is not covered by the adhesive layer 400 at theedge in contact with the bending protection layer 300. The bendingprotection layer 300 is disposed between the lower surface 220 of thepolarizing film 200 and the passivation layer 28. The bending protectionlayer 300 contacts the side surface 230 and the lower surface 220 of thepolarizing film 200, and contacts the upper surface and the side surfaceof the passivation layer 28. The bending protection layer 300 maycontact the side surface 410 of the adhesive layer 400.

As illustrated in FIG. 14, the side surface 230 of the polarizing film200 may be perpendicular to the lower surface 220, or may have a shapein which the upper side protrudes as illustrated in FIGS. 7 to 13.

In an exemplary embodiment of the invention, since the adhesive layer400 forms a space between the polarizing film 200 and the display panel100, and the bending protection layer 300 is disposed in a space betweenthe display panel 100 and the polarizing film 200 at which the adhesivelayer 400 is absent, the bending protection layer 300 may besubstantially prevented from being detached upwardly.

FIGS. 15A to 15G are cross-sectional views illustrating a method forfabricating a polarizing film according to an exemplary embodiment ofthe invention.

First, referring to FIG. 15A, the adhesive layer 400 is attached to thelower surface of the polarizing film 200, and a protective film 420 isattached to the lower surface of the adhesive layer 400. In addition,the release film 440 is attached to the upper surface of the polarizingfilm 200. Several sets of the polarizing film 200, the adhesive layer400, the protective film 420, and the release film 440 attached to eachother are prepared. The protective film 420 may substantially preventthe adhesive layer 400 from adhering to another film in a manufacturingprocess of the polarizing film 200 described below.

Next, as illustrated in FIG. 15B, the several units of the polarizingfilm 200, the adhesive layer 400, the protective film 420, and therelease film 440 attached to each other are stacked on each other.

Then, as illustrated in FIG. 15C, the polarizing film 200, the adhesivelayer 400, the protective film 420, and the release film 440 that arestacked to overlap each other are pressed in the thickness direction.

As described above, the adhesive layer 400 may include a PSA, forexample. As illustrated in FIG. 15D, when the adhesive layer 400 ispressed, the adhesive layer 400 is reduced in its thickness direction bythe elastic force thereof, and stretched in the horizontal directionperpendicular to the thickness direction.

Then, as illustrated in FIG. 15E, the stacked polarizing film 200 is cutor polished in the pressed state in an oblique direction as illustratedin FIG. 7 (or in a perpendicular direction as illustrated in FIG. 14)with respect to the lower surface 220 of the polarizing film 200. Theinternal angle between the side surface 230 and the lower surface 220 ofthe polarizing film 200 that is cut or polished may be an obtuse angle(refer to FIG. 7) or a right angle (refer to FIG. 14).

The side surface 230 of the cut or polished polarizing film 200 may havethe shape of the side surface 230 illustrated in FIGS. 8 to 13.

Next, the pressure applied to the stacked films is released aftercutting. As illustrated in FIG. 15F, when the pressure is released, theadhesive layer 400 is stretched in the thickness direction by itsrestoring force and contracts in the horizontal direction. The sidesurface 410 of the adhesive layer 400 may be recessed inwardly due tothe adhesive force with the protective film 420 or the polarizing film200. The adhesive layer 400 attached to the lower surface 220 of oneedge of the polarizing film 200 is removed, and an empty space 430(refer to FIG. 15F) without the adhesive layer 400 is defined beneaththe lower surface 220 of one edge of the polarizing film 200.

Next, as illustrated in FIG. 15G, the protective film 420 attached tothe lower surface of the adhesive layer 400 is removed, and the lowersurface of the adhesive layer 400 is attached to the upper flat portion71 of the display panel 100 (refer to FIGS. 6 to 14). Accordingly, theempty space 430 is defined between the upper flat portion 71 of thedisplay panel 100 and the polarizing film 200. The bending portion 72 isnot bent yet and is flat, and the pattern films 80 a and 80 b may beattached beneath the upper flat portion 71 and the lower flat portion 73before bending.

Next, as illustrated in FIG. 15H, the bending protection layer 300 isdisposed over the upper flat portion 71, the bending portion 72, and thelower flat portion 73 of the display panel 100. The bending protectionlayer 300 is injected into the empty space 430 between the display panel100 and the lower surface 220 of the polarizing film 200 at which theadhesive layer 400 is absent, and at least a part of the bendingprotection layer 300 contacts the lower surface 220 of the polarizingfilm 200. In an exemplary embodiment, the height of the upper surface ofthe bending protection layer 300 may be substantially equal to orgreater than the height of the upper surface 210 of the polarizing film200, and may be substantially equal to or less than the height of theupper surface of the release film 440.

Next, as illustrated in FIG. 151, the bending portion 72 provided withthe bending protection layer 300 is bent. Accordingly, the bendingprotection layer 300 is also bent, and the restoring force to deviateupwardly from the upper flat portion 71 is generated. In an exemplaryembodiment of the invention, the lower surface 220 and/or the inclinedside surface 230 of the polarizing film 200 may more effectively preventthe deviation of the bending protection layer 300.

Next, as illustrated in FIG. 15J, the release film 440 attached to theupper surface 210 (refer to FIG. 5) of the polarizing film 200 may beremoved. Accordingly, contamination of the polarizing film 200 in themanufacturing process of the display device 70 may be removed, or thebreakage of the polarizing film 200 may be substantially prevented.

As set forth hereinabove, according to one or more embodiments of thepresent invention, at least one side surface of the optical film incontact with the bending protection layer faces downwardly, andaccordingly, the bending protection layer may be substantially preventedfrom being detached upwardly.

While the invention has been illustrated and described with reference tothe exemplary embodiments thereof, it will be apparent to those ofordinary skill in the art that various changes in form and detail may beformed thereto without departing from the spirit and scope of theinvention.

What is claimed is:
 1. A method for fabricating a polarizing film, themethod comprising: attaching an adhesive layer to a surface of thepolarizing film; attaching a protective film to the adhesive layer;pressing the polarizing film to which the adhesive layer is attached sothat the adhesive layer is stretched in a horizontal direction parallelto the surface of the polarizing film; cutting an edge of the polarizingfilm to which the adhesive layer is attached in a pressurized state; andstopping the pressing of the polarizing film to which the adhesive layeris attached so that the adhesive layer is reduced in the horizontaldirection.
 2. The method of claim 1, further comprising: overlapping aplurality of polarizing films, each attached with the adhesive layer andthe protective film, wherein cutting the edge of the polarizing filmcomprises cutting an edge of the plurality of overlapped polarizingfilms.
 3. The method of claim 2, wherein the cutting the edge of thepolarizing film comprises cutting the polarizing film so that a cutsurface of the polarizing film is perpendicular to the surface of thepolarizing film.
 4. The method of claim 1, wherein the cutting the edgeof the polarizing film comprises cutting the polarizing film so that aninternal angle between a cut surface of the polarizing film and thesurface of the polarizing film is an obtuse angle.